Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401624 | Plating apparatus and method for electroplating wafer | Che-Min Lin, Hung-San Lu, Chao-Lung Chen, Chao-Yuan Chang, Chun-An Kung +3 more | 2022-08-02 |
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Wen-Chun Hou
Overall (2022): #214,736 of 548,613Top 40%
1
Patents 2022