Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488857 | Semiconductor device and method of manufacture using a contact etch stop layer (CESL) breakthrough process | Yu-Shih Wang, U-Ting Chiu, Chun-Neng Lin, Chia-Cheng Chen, Liang-Yin Chen +2 more | 2022-11-01 |
| 11488859 | Semiconductor device and method | Yu-Shih Wang, Ming-Hsi Yeh | 2022-11-01 |
| 11424185 | Semiconductor device and manufacturing method thereof | Cheng-Wei Chang, Chia-Hung Chu, Kao-Feng Lin, Hsu-Kai Chang, Shuen-Shin Liang +6 more | 2022-08-23 |
| 11276571 | Method of breaking through etch stop layer | Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, U-Ting Chiu, Chun-Neng Lin +2 more | 2022-03-15 |