Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532612 | Inter-level connection for multi-layer structures | Yi-Tang Lin, Clement Hsingjen Wann | 2022-12-20 |
| 11362000 | Wrap-around contact on FinFET | Sung-Li Wang, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin, Gin-Chen Huang +5 more | 2022-06-14 |