Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532612 | Inter-level connection for multi-layer structures | Yi-Tang Lin, Neng-Kuo Chen | 2022-12-20 |
| 11508627 | Method of metal gate formation and structures formed by the same | Yi-Jing Lee, Ya-Yun Cheng, Hau-Yu Lin, I-Sheng Chen, Chia-Ming Hsu +1 more | 2022-11-22 |
| 11502186 | FinFET device having a channel defined in a diamond-like shape semiconductor structure | You-Ru Lin, Cheng-Hsien Wu, Chih-Hsin Ko | 2022-11-15 |
| 11450571 | Method for manufacturing semiconductor structure | Chun Hsiung Tsai, Cheng-Yi Peng, Ching-Hua Lee, Chung-Cheng Wu | 2022-09-20 |
| 11450661 | Forming STI regions to separate semiconductor Fins | Chih-Yu Hsu, Yi-Tang Lin, Chih-Sheng Chang, Wei-Chun Tsai, Jyh-Cherng Sheu +1 more | 2022-09-20 |
| 11437517 | Semiconductor structures and methods with high mobility and high energy bandgap materials | Cheng-Hsien Wu, Chih-Hsin Ko | 2022-09-06 |
| 11437493 | Gate spacer structures and methods for forming the same | Chun Hsiung Tsai, Kuo-Feng Yu, Ming-Hsi Yeh, Shahaji B. More, Yu-Ming Lin | 2022-09-06 |
| 11404322 | Method of manufacturing a semiconductor device | Chun Hsiung Tsai, Yu-Ming Lin, Kuo-Feng Yu, Ming-Hsi Yeh, Shahaji B. More +2 more | 2022-08-02 |
| 11362000 | Wrap-around contact on FinFET | Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Yi-An Lin +5 more | 2022-06-14 |
| 11329139 | Semiconductor device with reduced trap defect and method of forming the same | Chun Hsiung Tsai, Kuo-Feng Yu, Yu-Ming Lin | 2022-05-10 |
| 11232943 | Method and structure for semiconductor interconnect | Ru-Shang Hsiao, Chun Hsiung Tsai | 2022-01-25 |
| 11233140 | Semiconductor device and manufacturing method thereof | Chun Hsiung Tsai, Kuo-Feng Yu, Yi-Tang Lin, Yu-Ming Lin | 2022-01-25 |