Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450584 | Warpage control of semiconductor die | Yun-Ting Wang, Ching-Chuan Chang, Po-Chang Kuo | 2022-09-20 |
| 11362000 | Wrap-around contact on FinFET | Sung-Li Wang, Neng-Kuo Chen, Ding-Kang Shih, Meng-Chun Chang, Gin-Chen Huang +5 more | 2022-06-14 |