Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532612 | Inter-level connection for multi-layer structures | Clement Hsingjen Wann, Neng-Kuo Chen | 2022-12-20 |
| 11450661 | Forming STI regions to separate semiconductor Fins | Chih-Yu Hsu, Clement Hsingjen Wann, Chih-Sheng Chang, Wei-Chun Tsai, Jyh-Cherng Sheu +1 more | 2022-09-20 |
| 11239365 | Structure and method for providing line end extensions for fin-type active regions | Shao-Ming Yu, Chang-Yun Chang, Chih-Hao Chang, Hsin-Chih Chen, Kai-Tai Chang +2 more | 2022-02-01 |
| 11233140 | Semiconductor device and manufacturing method thereof | Chun Hsiung Tsai, Clement Hsingjen Wann, Kuo-Feng Yu, Yu-Ming Lin | 2022-01-25 |