Issued Patents 2022
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11309212 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Li-Zhen Yu, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-04-19 |
| 11302798 | Semiconductor devices with air gate spacer and air gate cap | Cheng-Chi Chuang, Lin-Yu Huang, Yu-Ming Lin, Ting-Ya Lo, Chi-Lin Teng +2 more | 2022-04-12 |
| 11276763 | Contacts for highly scaled transistors | Carlos H. Diaz, Chung-Cheng Wu, Chih-Hao Wang, Jean-Pierre Colinge, Chun-Hsiung Lin +2 more | 2022-03-15 |
| 11264326 | Contact via formation | Lin-Yu Huang, Li-Zhen Yu, Kuan-Lun Cheng, Chih-Hao Wang, Cheng-Chi Chuang | 2022-03-01 |
| 11264284 | Semiconductor device and method of fabricating the same | Jia-Chuan You, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang | 2022-03-01 |
| 11257926 | Self-aligned contact structures | Li-Zhen Yu, Lin-Yu Huang, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang | 2022-02-22 |
| 11257758 | Backside connection structures for nanostructures and methods of forming the same | Li-Zhen Yu, Lin-Yu Huang, Cheng-Chi Chuang, Chih-Hao Wang | 2022-02-22 |
| 11251305 | Fin field effect transistor device structure and method for forming the same | Lin-Yu Huang, Li-Zhen Yu, Cheng-Chi Chuang, Yu-Ming Lin, Chih-Hao Wang | 2022-02-15 |
| 11244899 | Butted contacts and methods of fabricating the same in semiconductor devices | Jia-Chuan You, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang | 2022-02-08 |
| 11239325 | Semiconductor device having backside via and method of fabricating thereof | Lin-Yu Huang, Li-Zhen Yu, Cheng-Chi Chuang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-02-01 |
| 11239106 | Source/drain isolation structure and methods thereof | Lin-Yu Huang, Sheng-Tsung Wang, Tien-Lu Lin, Yu-Ming Lin, Chih-Hao Wang | 2022-02-01 |
| 11217480 | Semiconductor structure with a laminated layer | Chia-Lin Chuang, Sheng-Tsung Wang, Lin-Yu Huang, Tien-Lu Lin, Yu-Ming Lin +1 more | 2022-01-04 |
| 11215233 | Rotating spindle capable of conductively contacting via bearings | — | 2022-01-04 |