Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469133 | Bonding apparatus and semiconductor package fabrication equipment including the same | Seok Geun Ahn, Min-Keun Kwak, Ji Won Shin, Sang Hoon Lee | 2022-10-11 |
BJ
Byoung Wook Jang
Overall (2022): #508,208 of 548,613Top 95%
1
Patents 2022