Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515262 | Semiconductor package and method of fabricating the same | JuHyung Lee, Sunchul Kim | 2022-11-29 |
| 11469133 | Bonding apparatus and semiconductor package fabrication equipment including the same | Min-Keun Kwak, Ji Won Shin, Sang Hoon Lee, Byoung Wook Jang | 2022-10-11 |