Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469133 | Bonding apparatus and semiconductor package fabrication equipment including the same | Seok Geun Ahn, Min-Keun Kwak, Sang Hoon Lee, Byoung Wook Jang | 2022-10-11 |
JS
Ji Won Shin
Overall (2022): #403,077 of 548,613Top 75%
1
Patents 2022