Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11469133 | Bonding apparatus and semiconductor package fabrication equipment including the same | Seok Geun Ahn, Ji Won Shin, Sang Hoon Lee, Byoung Wook Jang | 2022-10-11 |
| 11450614 | Semiconductor package | Jung Joo Kim, Sun Chul Kim, Hyun Ki Kim, Hyung-Gil Baek, Yong Kwan Lee | 2022-09-20 |