Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11509126 | Wiring structure with movement mechanism | Tetsuya Utano | 2022-11-22 |
| 11508688 | Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips | Yuji Eguchi, Shoji Wada | 2022-11-22 |
| 11469125 | Device and method for linearly moving first and second moving bodies relative to target object | Tetsuya Utano, Yuichiro Noguchi | 2022-10-11 |
| 11410960 | Bonding apparatus | Tetsuya Utano | 2022-08-09 |
| 11410866 | Apparatus and method for linearly moving movable body relative to object | Tetsuya Utano, Yuichiro Noguchi | 2022-08-09 |
| 11393700 | Bonding apparatus and bonding method | Yuichiro Noguchi | 2022-07-19 |
| 11373975 | Electronic component mounting device | — | 2022-06-28 |
| 11302666 | Mounting head | Manato Nishide, Hijiri Hayashi | 2022-04-12 |