Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508688 | Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips | Kohei Seyama, Shoji Wada | 2022-11-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508688 | Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips | Kohei Seyama, Shoji Wada | 2022-11-22 |