Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521890 | Apparatus for manufacturing semiconductor device | — | 2022-12-06 |
| 11508688 | Bonding apparatus including a heater and a cooling flow path used for stacking a plurality of semiconductor chips | Kohei Seyama, Yuji Eguchi | 2022-11-22 |