Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11509126 | Wiring structure with movement mechanism | Kohei Seyama | 2022-11-22 |
| 11469125 | Device and method for linearly moving first and second moving bodies relative to target object | Kohei Seyama, Yuichiro Noguchi | 2022-10-11 |
| 11410866 | Apparatus and method for linearly moving movable body relative to object | Kohei Seyama, Yuichiro Noguchi | 2022-08-09 |
| 11410960 | Bonding apparatus | Kohei Seyama | 2022-08-09 |