Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521921 | Semiconductor device package assemblies and methods of manufacture | Jeungdae KIM, Oseob Jeon | 2022-12-06 |
| 11264311 | Clips for semiconductor package and related methods | Inpil Yoo, Jooyang EOM, Jerome Teysseyre | 2022-03-01 |