Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521921 | Semiconductor device package assemblies and methods of manufacture | Seungwon IM, Oseob Jeon | 2022-12-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521921 | Semiconductor device package assemblies and methods of manufacture | Seungwon IM, Oseob Jeon | 2022-12-06 |