Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11513220 | Molded proximity sensor | Jing-En Luan | 2022-11-29 |
| 11430777 | Power module package for direct cooling multiple power modules | Inpil Yoo, Jooyang EOM | 2022-08-30 |
| 11296069 | Substrate interposer on a leaderframe | Elsie Agdon Cabahug, Marie Clemens Ypil Quinones, Maria Cristina Estacio, Romel N. Manatad, Chung-Lin Wu | 2022-04-05 |
| 11264311 | Clips for semiconductor package and related methods | Inpil Yoo, Seungwon IM, Jooyang EOM | 2022-03-01 |
| 11231386 | Compact microelectronic integrated gas sensor | Yonggang Jin, Suman Cherian | 2022-01-25 |
| 11222832 | Power semiconductor device package | Tiburcio A. Maldo, Keunhyuk LEE | 2022-01-11 |