Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315856 | Leadframe with sockets for solderless pins | Keunhyuk LEE | 2022-04-26 |
| 11222832 | Power semiconductor device package | Keunhyuk LEE, Jerome Teysseyre | 2022-01-11 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11315856 | Leadframe with sockets for solderless pins | Keunhyuk LEE | 2022-04-26 |
| 11222832 | Power semiconductor device package | Keunhyuk LEE, Jerome Teysseyre | 2022-01-11 |