Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11430777 | Power module package for direct cooling multiple power modules | Jerome Teysseyre, Jooyang EOM | 2022-08-30 |
| 11264311 | Clips for semiconductor package and related methods | Seungwon IM, Jooyang EOM, Jerome Teysseyre | 2022-03-01 |