Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302661 | Package substrate including segment grooves arranged in a radial direction of a redistribution pad and semiconductor package including the same | Youngkyu Lim, Gookmi Song | 2022-04-12 |
| 11264339 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Gyujin Choi, Sunghoan Kim, Changeun Joo, Chilwoo KWON, Youngkyu Lim | 2022-03-01 |