Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264339 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Gyujin Choi, Sunghoan Kim, Changeun Joo, Youngkyu Lim, Sunguk LEE | 2022-03-01 |