Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393767 | Semiconductor package and package-on-package devices including same | Sunghawn Bae, Jeongrim Seo | 2022-07-19 |
| 11264339 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Gyujin Choi, Changeun Joo, Chilwoo KWON, Youngkyu Lim, Sunguk LEE | 2022-03-01 |