Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373955 | Semiconductor package and method of manufacturing the semiconductor package | Changeun Joo | 2022-06-28 |
| 11264339 | Method of manufacturing connection structure of semiconductor chip and method of manufacturing semiconductor package | Sunghoan Kim, Changeun Joo, Chilwoo KWON, Youngkyu Lim, Sunguk LEE | 2022-03-01 |