Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462464 | Fan-out semiconductor package having redistribution line structure | Jong Youn Kim | 2022-10-04 |
| 11355440 | Semiconductor package including interposer | Jong Youn Kim | 2022-06-07 |
| 11322368 | Method for fabricating semiconductor package | Jung-Ho Park, Jin-Woo Park, Jae Gwon Jang, Gwang Jae Jeon | 2022-05-03 |