Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11373980 | Semiconductor package | Jong Youn Kim, Dong Kyu Kim, Jin-Woo Park, Min Jun Bae | 2022-06-28 |
| 11328970 | Methods of fabricating semiconductor package | Jung-Ho Park, Jin-Woo Park, Jae Gwon Jang | 2022-05-10 |
| 11322368 | Method for fabricating semiconductor package | Jung-Ho Park, Jin-Woo Park, Seok Hyun LEE, Jae Gwon Jang | 2022-05-03 |