Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404346 | Semiconductor package | Dong Kyu Kim, Jung-Ho Park, Jong Youn Kim, Yeon Ho JANG | 2022-08-02 |
| 11328970 | Methods of fabricating semiconductor package | Jung-Ho Park, Jin-Woo Park, Gwang Jae Jeon | 2022-05-10 |
| 11322368 | Method for fabricating semiconductor package | Jung-Ho Park, Jin-Woo Park, Seok Hyun LEE, Gwang Jae Jeon | 2022-05-03 |