Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462464 | Fan-out semiconductor package having redistribution line structure | Seok Hyun LEE | 2022-10-04 |
| 11404346 | Semiconductor package | Dong Kyu Kim, Jung-Ho Park, Yeon Ho JANG, Jae Gwon Jang | 2022-08-02 |
| 11373980 | Semiconductor package | Dong Kyu Kim, Jin-Woo Park, Min Jun Bae, Gwang Jae Jeon | 2022-06-28 |
| 11355440 | Semiconductor package including interposer | Seok Hyun LEE | 2022-06-07 |