Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482448 | Planarization method of a capping insulating layer, a method of forming a semiconductor device using the same, and a semiconductor device formed thereby | Hansol Seok, Changsun Hwang, Gihwan Kim, Jongheun Lim | 2022-10-25 |
| 11417675 | Three-dimensional semiconductor memory devices | Kiseok Jang, Chang Sun Hwang, Kieun Seo, Jongheun Lim | 2022-08-16 |
| 11257708 | Gap-fill layers, methods of forming the same, and semiconductor devices manufactured by the methods of forming the same | Miso Shin, Gihwan Kim, Sanghyeok KIM, Hyo Jung Kim, Geunwon Lim | 2022-02-22 |