Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257708 | Gap-fill layers, methods of forming the same, and semiconductor devices manufactured by the methods of forming the same | Miso Shin, Chungki Min, Gihwan Kim, Hyo Jung Kim, Geunwon Lim | 2022-02-22 |