Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482448 | Planarization method of a capping insulating layer, a method of forming a semiconductor device using the same, and a semiconductor device formed thereby | Chungki Min, Changsun Hwang, Gihwan Kim, Jongheun Lim | 2022-10-25 |