Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11482448 | Planarization method of a capping insulating layer, a method of forming a semiconductor device using the same, and a semiconductor device formed thereby | Hansol Seok, Chungki Min, Changsun Hwang, Gihwan Kim | 2022-10-25 |
| 11417675 | Three-dimensional semiconductor memory devices | Kiseok Jang, Chang Sun Hwang, Chungki Min, Kieun Seo | 2022-08-16 |