Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488911 | Flip-chip package substrate | Chu-Chin Hu | 2022-11-01 |
| 11476204 | Flip-chip packaging substrate and method for fabricating the same | Pao-Hung Chou, Chun-Hsien Yu, Tung-Yao Kuo | 2022-10-18 |
| 11450597 | Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same | Pao-Hung Chou, Chun-Hsien Yu | 2022-09-20 |
| 11417581 | Package structure | Chin-Wen Liu, Tang-I Wu, Shu-Wei Hu | 2022-08-16 |
| 11404348 | Semiconductor package carrier board, method for fabricating the same, and electronic package having the same | Pao-Hung Chou, Chun-Hsien Yu, Wen-Chang Chen | 2022-08-02 |
| 11387806 | Surface acoustic wave filter package structure and method of manufacturing the same | Che-Wei Hsu | 2022-07-12 |
| 11335630 | Semiconductor package substrate, electronic package and methods for fabricating the same | Pao-Hung Chou, Chun-Hsien Yu | 2022-05-17 |
| 11246223 | Package apparatus | — | 2022-02-08 |
| 11222880 | Package structure for semiconductor device and manufacturing method thereof | Che-Wei Hsu | 2022-01-11 |