Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476204 | Flip-chip packaging substrate and method for fabricating the same | Pao-Hung Chou, Chun-Hsien Yu, Shih-Ping Hsu | 2022-10-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476204 | Flip-chip packaging substrate and method for fabricating the same | Pao-Hung Chou, Chun-Hsien Yu, Shih-Ping Hsu | 2022-10-18 |