Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508673 | Semiconductor packaging substrate, fabrication method and packaging process thereof | Chun-Hsien Yu | 2022-11-22 |
| 11476204 | Flip-chip packaging substrate and method for fabricating the same | Chun-Hsien Yu, Shih-Ping Hsu, Tung-Yao Kuo | 2022-10-18 |
| 11450597 | Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same | Chun-Hsien Yu, Shih-Ping Hsu | 2022-09-20 |
| 11404348 | Semiconductor package carrier board, method for fabricating the same, and electronic package having the same | Chun-Hsien Yu, Shih-Ping Hsu, Wen-Chang Chen | 2022-08-02 |
| 11335630 | Semiconductor package substrate, electronic package and methods for fabricating the same | Chun-Hsien Yu, Shih-Ping Hsu | 2022-05-17 |