Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508673 | Semiconductor packaging substrate, fabrication method and packaging process thereof | Pao-Hung Chou | 2022-11-22 |
| 11483939 | Electronic device with display interface | You Li | 2022-10-25 |
| 11476204 | Flip-chip packaging substrate and method for fabricating the same | Pao-Hung Chou, Shih-Ping Hsu, Tung-Yao Kuo | 2022-10-18 |
| 11455498 | Model training method and electronic device | Cheng-Tien Hsieh, Shih-Ho Huang, Meng-Che Cheng, Kun-Hsien Chou, Ching-Po Lin +1 more | 2022-09-27 |
| 11450597 | Semiconductor package substrate having heat dissipating metal sheet on solder pads, method for fabricating the same, and electronic package having the same | Pao-Hung Chou, Shih-Ping Hsu | 2022-09-20 |
| 11404348 | Semiconductor package carrier board, method for fabricating the same, and electronic package having the same | Pao-Hung Chou, Shih-Ping Hsu, Wen-Chang Chen | 2022-08-02 |
| 11379722 | Method for training generative adversarial network (GAN), method for generating images by using GAN, and computer readable storage medium | Edward Chang, Che-Han Chang, Szu-Ying Chen | 2022-07-05 |
| 11335630 | Semiconductor package substrate, electronic package and methods for fabricating the same | Pao-Hung Chou, Shih-Ping Hsu | 2022-05-17 |
| 11253228 | Ultrasonic scanning method and ultrasonic scanning device | Kuo-Nan Chen | 2022-02-22 |
| 11238374 | Method for verifying training data, training system, and computer readable medium | Hao-Cheng Kao, Chih-Yang Chen, Shan-Yi Yu, Edzer Lienson Wu, Che-Han Chang | 2022-02-01 |