Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11410883 | Tungsten feature fill with nucleation inhibition | Anand Chandrashekar, Esther Jeng, Raashina Humayun, Juwen Gao, Deqi Wang | 2022-08-09 |
| 11355345 | Method for preventing line bending during metal fill process | Adam Jandl, Sema Ermez, Lawrence Schloss, Sanjay Gopinath, Siew Neo +2 more | 2022-06-07 |
| 11348795 | Metal fill process for three-dimensional vertical NAND wordline | Lawrence Schloss, Raashina Humayun, Sanjay Gopinath, Juwen Gao, Kaihan Ashtiani | 2022-05-31 |
| 11263737 | Defect classification and source analysis for semiconductor equipment | Kapil Sawlani, Richard A. Gottscho, Keith Wells, Keith J. Hansen | 2022-03-01 |