Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476211 | Semiconductor package and manufacturing method thereof | Su Yun Kim, Dong Hoon OH, Yong Tae Kwon, Ju Hyun Nam | 2022-10-18 |
| 11450535 | Manufacturing method for semiconductor package including filling member and membrane member | Yong Tae Kwon, Si Woo Lim, Dong Hoon OH, Jun-Sung Ma, Tae Won Kim | 2022-09-20 |
| 11264330 | Chip package with connection portion that passes through an encapsulation portion | Yongtae Kwon, Eung Ju Lee, Yong Woon Yeo, Yun Mook Park, Hyo Young Kim +1 more | 2022-03-01 |