Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476211 | Semiconductor package and manufacturing method thereof | Jun Kyu Lee, Su Yun Kim, Dong Hoon OH, Ju Hyun Nam | 2022-10-18 |
| 11450535 | Manufacturing method for semiconductor package including filling member and membrane member | Jun Kyu Lee, Si Woo Lim, Dong Hoon OH, Jun-Sung Ma, Tae Won Kim | 2022-09-20 |