Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476211 | Semiconductor package and manufacturing method thereof | Jun Kyu Lee, Dong Hoon OH, Yong Tae Kwon, Ju Hyun Nam | 2022-10-18 |
| 11393768 | Semiconductor package and manufacturing method thereof | Dong Hoon OH, Ju Hyun Nam | 2022-07-19 |