Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404347 | Semiconductor package | Nam Chul Kim, Jong-Heon Kim, Yong Woon Yeo, Chang Woo Lee | 2022-08-02 |
| 11264330 | Chip package with connection portion that passes through an encapsulation portion | Yongtae Kwon, Yong Woon Yeo, Yun Mook Park, Hyo Young Kim, Jun Kyu Lee +1 more | 2022-03-01 |