Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11415538 | Capacitive sensor housing for chamber condition monitoring | Patrick Tae, Leonard Tedeschi, Michael D. Willwerth, Daniel T. McCormick | 2022-08-16 |
| 11282760 | Integrated packaging devices and methods with backside interconnections | Tallis Young Chang, John H. Hong | 2022-03-22 |