Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11478868 | Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsink | Ryouhei Yumoto, Soutarou Ooi | 2022-10-25 |
| 11404622 | Insulated heat transfer substrate, thermoelectric conversion module, and method for manufacturing insulated heat transfer substrate | Koya Arai, Shuji Nishimoto, Masahito Komasaki, Yoshirou Kuromitsu | 2022-08-02 |
| 11393738 | Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate | Nobuyuki Terasaki | 2022-07-19 |
| 11355408 | Method of manufacturing insulating circuit board with heatsink | Takeshi Kitahara | 2022-06-07 |
| 11322424 | Insulation circuit board with heat sink | Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2022-05-03 |
| 11289390 | Insulation circuit board with heat sink | Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2022-03-29 |
| 11289400 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Tomoya Oohiraki, Takeshi Kitahara | 2022-03-29 |