Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11396059 | Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method | — | 2022-07-26 |
| 11393738 | Bonded body, power module substrate, power module, method for manufacturing bonded body, and method for manufacturing power module substrate | Yoshiyuki Nagatomo | 2022-07-19 |