Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476127 | Manufacturing method of electronic-component-mounted module | Sotaro Oi | 2022-10-18 |
| 11355415 | Heat sink-attached power module substrate board and power module | Sotaro Oi | 2022-06-07 |
| 11322424 | Insulation circuit board with heat sink | Ryohei Yumoto, Takeshi Kitahara, Yoshiyuki Nagatomo | 2022-05-03 |
| 11315868 | Electronic-component-mounted module design to reduce linear expansion coefficient mismatches | Sotaro Oi | 2022-04-26 |
| 11289390 | Insulation circuit board with heat sink | Ryohei Yumoto, Takeshi Kitahara, Yoshiyuki Nagatomo | 2022-03-29 |
| 11289400 | Method of manufacturing bonded body for insulation circuit substrate board and bonded body for insulation circuit substrate board | Ryohei Yumoto, Takeshi Kitahara, Yoshiyuki Nagatomo | 2022-03-29 |