Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476127 | Manufacturing method of electronic-component-mounted module | Tomoya Oohiraki | 2022-10-18 |
| 11462456 | Power-module substrate with heat-sink | Ryohei Yumoto | 2022-10-04 |
| 11355415 | Heat sink-attached power module substrate board and power module | Tomoya Oohiraki | 2022-06-07 |
| 11315868 | Electronic-component-mounted module design to reduce linear expansion coefficient mismatches | Tomoya Oohiraki | 2022-04-26 |
| 11302602 | Power-module substrate with heat-sink | Ryohei Yumoto | 2022-04-12 |