Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11478868 | Method for producing bonded body, method for producing insulated circuit board, and method for producing insulated circuit board with heatsink | Yoshiyuki Nagatomo, Soutarou Ooi | 2022-10-25 |