Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11424214 | Hybrid interconnect for laser bonding using nanoporous metal tips | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Ali Sengül | 2022-08-23 |
| 11417792 | Interconnect with nanotube fitting | Ali Sengül, Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Tennyson Nguty | 2022-08-16 |
| 11404600 | Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers | Jeb Wu, Daniel Brodoceanu, Tennyson Nguty, Oscar Torrents Abad, Ali Sengül | 2022-08-02 |
| 11374148 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Sharon Nanette Farrens, Ali Sengül +1 more | 2022-06-28 |
| 11349053 | Flexible interconnect using conductive adhesive | Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Jeb Wu, Pooya Saketi +3 more | 2022-05-31 |
| 11296268 | Magnetic clamping interconnects | Ali Sengül, Oscar Torrents Abad, Daniel Brodoceanu, Jeb Wu, Chao Kai Tung +2 more | 2022-04-05 |
| 11276672 | Bonding dummy electrodes of light emitting diode chip to substrate | Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Ali Sengül | 2022-03-15 |
| 11255529 | Bonding corners of light emitting diode chip to substrate using laser | Jeb Wu, Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Ali Sengül | 2022-02-22 |
| 11239400 | Curved pillar interconnects | Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi, Jeb Wu +4 more | 2022-02-01 |