Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11374148 | Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating | Daniel Brodoceanu, Oscar Torrents Abad, Jeb Wu, Zheng Sung Chio, Ali Sengül +1 more | 2022-06-28 |