| 11424214 |
Hybrid interconnect for laser bonding using nanoporous metal tips |
Daniel Brodoceanu, Zheng Sung Chio, Oscar Torrents Abad, Ali Sengül |
2022-08-23 |
| 11417792 |
Interconnect with nanotube fitting |
Ali Sengül, Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Tennyson Nguty |
2022-08-16 |
| 11404600 |
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers |
Daniel Brodoceanu, Zheng Sung Chio, Tennyson Nguty, Oscar Torrents Abad, Ali Sengül |
2022-08-02 |
| 11391967 |
Transparent circuit boards with multilayered traces |
Karol Constantine Hatzilias, Paul A. Tchertchian, Robin Sharma, Christopher Yuan Ting Liao |
2022-07-19 |
| 11374148 |
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating |
Daniel Brodoceanu, Oscar Torrents Abad, Zheng Sung Chio, Sharon Nanette Farrens, Ali Sengül +1 more |
2022-06-28 |
| 11349053 |
Flexible interconnect using conductive adhesive |
Zheng Sung Chio, Daniel Brodoceanu, Ali Sengül, Oscar Torrents Abad, Pooya Saketi +3 more |
2022-05-31 |
| 11296268 |
Magnetic clamping interconnects |
Ali Sengül, Oscar Torrents Abad, Daniel Brodoceanu, Zheng Sung Chio, Chao Kai Tung +2 more |
2022-04-05 |
| 11276672 |
Bonding dummy electrodes of light emitting diode chip to substrate |
Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül |
2022-03-15 |
| 11255529 |
Bonding corners of light emitting diode chip to substrate using laser |
Oscar Torrents Abad, Daniel Brodoceanu, Pooya Saketi, Zheng Sung Chio, Ali Sengül |
2022-02-22 |
| 11239400 |
Curved pillar interconnects |
Zheng Sung Chio, Daniel Brodoceanu, Oscar Torrents Abad, Ali Sengül, Pooya Saketi +4 more |
2022-02-01 |
